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Overview of EDI8F32259C25MNC by Electronic Designs Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for EDI8F32259C25MNC by Electronic Designs Inc
Part Data Attributes for EDI8F32259C25MNC by Electronic Designs Inc
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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ELECTRONIC DESIGNS INC
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Reach Compliance Code
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unknown
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Access Time-Max
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25 ns
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Additional Feature
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CONFIGURABLE AS 256K X 32 OR 512K X 16
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I/O Type
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COMMON
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JESD-30 Code
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R-XSMA-N72
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Memory Density
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8388608 bit
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Memory IC Type
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SRAM MODULE
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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72
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Number of Words
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1048576 words
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Number of Words Code
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1000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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1MX8
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Output Characteristics
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3-STATE
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Package Body Material
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UNSPECIFIED
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Package Code
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SIMM
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Package Equivalence Code
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SSIM72
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Package Shape
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RECTANGULAR
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Package Style
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MICROELECTRONIC ASSEMBLY
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Seated Height-Max
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17.272 mm
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Standby Current-Max
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0.04 A
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Standby Voltage-Min
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4.5 V
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Supply Current-Max
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1.28 mA
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Form
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NO LEAD
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Terminal Pitch
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1.27 mm
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Terminal Position
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SINGLE
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