Part Details for EDI88512LPA20F32C by White Electronic Designs Corp
Overview of EDI88512LPA20F32C by White Electronic Designs Corp
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Part Details for EDI88512LPA20F32C
EDI88512LPA20F32C CAD Models
EDI88512LPA20F32C Part Data Attributes
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EDI88512LPA20F32C
White Electronic Designs Corp
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Datasheet
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EDI88512LPA20F32C
White Electronic Designs Corp
Standard SRAM, 512KX8, 20ns, CMOS, CDFP32, CERAMIC, DFP-32
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | CERAMIC, DFP-32 | |
Reach Compliance Code | unknown | |
Access Time-Max | 20 ns | |
Additional Feature | TTL COMPATIBLE INPUTS/OUTPUTS | |
I/O Type | COMMON | |
JESD-30 Code | R-CDFP-F32 | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DFP | |
Package Equivalence Code | FL32,.4 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.8448 mm | |
Standby Current-Max | 0.002 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.225 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 10.7442 mm |