Part Details for EDI88257LPA20CM by White Electronic Designs Corp
Overview of EDI88257LPA20CM by White Electronic Designs Corp
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Applications
Industrial Automation
Part Details for EDI88257LPA20CM
EDI88257LPA20CM CAD Models
EDI88257LPA20CM Part Data Attributes
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EDI88257LPA20CM
White Electronic Designs Corp
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Datasheet
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EDI88257LPA20CM
White Electronic Designs Corp
Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 20 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CDIP-T32 | |
Length | 40.64 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.937 mm | |
Standby Current-Max | 0.002 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.225 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |