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Overview of EDI88130CS45LB by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for EDI88130CS45LB by Microsemi Corporation
Part Data Attributes for EDI88130CS45LB by Microsemi Corporation
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Pbfree Code
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No
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Rohs Code
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No
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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MICROSEMI CORP
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Package Description
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LCC-32
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Reach Compliance Code
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unknown
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ECCN Code
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3A001.A.2.C
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HTS Code
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8542.32.00.41
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Access Time-Max
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45 ns
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JESD-30 Code
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R-CDSO-N32
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JESD-609 Code
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e0
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Length
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21.082 mm
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Memory Density
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1048576 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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32
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Number of Words
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131072 words
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Number of Words Code
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128000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
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128KX8
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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SON
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE
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Parallel/Serial
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PARALLEL
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Screening Level
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MIL-STD-883
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Seated Height-Max
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2.4384 mm
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Finish
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TIN LEAD
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Terminal Form
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NO LEAD
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Terminal Pitch
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1.27 mm
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Terminal Position
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DUAL
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Width
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10.16 mm
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