Part Details for EDI88128LPS55TI by Microsemi Corporation
Overview of EDI88128LPS55TI by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for EDI88128LPS55TI
EDI88128LPS55TI CAD Models
EDI88128LPS55TI Part Data Attributes
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EDI88128LPS55TI
Microsemi Corporation
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EDI88128LPS55TI
Microsemi Corporation
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 40.64 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.937 mm | |
| Standby Current-Max | 0.002 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.2 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10.16 mm |
Alternate Parts for EDI88128LPS55TI
This table gives cross-reference parts and alternative options found for EDI88128LPS55TI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88128LPS55TI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT5C1009C-55L/883C | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Micross Components | EDI88128LPS55TI vs MT5C1009C-55L/883C |
| EDI88128LPS55TC | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs EDI88128LPS55TC |
| 5962-8959809MZA | Standard SRAM, 128KX8, 55ns, CMOS, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs 5962-8959809MZA |
| EDI88128CS55TM | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs EDI88128CS55TM |
| EDI88128CS55TB | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs EDI88128CS55TB |
| 5962-8959826MZA | Standard SRAM, 128KX8, 55ns, CMOS, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs 5962-8959826MZA |
| EDI88128LPS55TM | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88128LPS55TI vs EDI88128LPS55TM |