Part Details for DS3676J by National Semiconductor Corporation
Overview of DS3676J by National Semiconductor Corporation
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Part Details for DS3676J
DS3676J CAD Models
DS3676J Part Data Attributes:
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DS3676J
National Semiconductor Corporation
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Datasheet
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DS3676J
National Semiconductor Corporation
IC,MISC MEMORY,BIPOLAR,DIP,16PIN,CERAMIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
JESD-30 Code | R-XDIP-T16 | |
JESD-609 Code | e0 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |