Part Details for DPZ256X8A3-25B by B&B Electronics Manufacturing Company
Overview of DPZ256X8A3-25B by B&B Electronics Manufacturing Company
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for DPZ256X8A3-25B
DPZ256X8A3-25B CAD Models
DPZ256X8A3-25B Part Data Attributes
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DPZ256X8A3-25B
B&B Electronics Manufacturing Company
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DPZ256X8A3-25B
B&B Electronics Manufacturing Company
Flash Module, 256KX8, 250ns, CPGA50
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
| Package Description | PGA, PGA50,5X10 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Data Polling | NO | |
| JESD-30 Code | R-XPGA-P50 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | FLASH MODULE | |
| Memory Width | 8 | |
| Number of Terminals | 50 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX8 | |
| Package Body Material | CERAMIC | |
| Package Code | PGA | |
| Package Equivalence Code | PGA50,5X10 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B (Modified) | |
| Standby Current-Max | 0.0004 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Toggle Bit | NO | |
| Type | NOR TYPE |