Part Details for DPS512X32MKV3-45I by B&B Electronics Manufacturing Company
Overview of DPS512X32MKV3-45I by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS512X32MKV3-45I
DPS512X32MKV3-45I CAD Models
DPS512X32MKV3-45I Part Data Attributes
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DPS512X32MKV3-45I
B&B Electronics Manufacturing Company
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Datasheet
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DPS512X32MKV3-45I
B&B Electronics Manufacturing Company
SRAM Module, 512KX32, 45ns, CMOS, 1.190 X 1.190 INCH, 0.250 INCH HEIGHT, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-66
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
| Part Package Code | PGA | |
| Package Description | APGA, | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 45 ns | |
| Additional Feature | CONFIGURABLE AS 2M X 8 | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | R-XPGA-P66 | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX32 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | UNSPECIFIED | |
| Package Code | APGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, PIGGYBACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.35 mm | |
| Standby Voltage-Min | 2 V | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR |
Alternate Parts for DPS512X32MKV3-45I
This table gives cross-reference parts and alternative options found for DPS512X32MKV3-45I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512X32MKV3-45I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| DPS512X32MKV3-45M | B&B Electronics Manufacturing Company | Check for Price | SRAM Module, 512KX32, 45ns, CMOS, 1.190 X 1.190 INCH, 0.250 INCH HEIGHT, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-66 | DPS512X32MKV3-45I vs DPS512X32MKV3-45M |
| DPS512X32MKV3-45I | Twilight Technology Inc | Check for Price | SRAM Module, 512KX32, 45ns, CMOS, 1.190 X 1.190 INCH, 0.250 INCH HEIGHT, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-66 | DPS512X32MKV3-45I vs DPS512X32MKV3-45I |
| DPS512X32MKV3-45B | B&B Electronics Manufacturing Company | Check for Price | SRAM Module, 512KX32, 45ns, CMOS, 1.190 X 1.190 INCH, 0.250 INCH HEIGHT, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-66 | DPS512X32MKV3-45I vs DPS512X32MKV3-45B |