Memory
DPS256X32CV3-35C
Description: SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

Overview of DPS256X32CV3-35C by Twilight Technology Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
R0K521350S000BE Renesas Electronics Corporation Renesas Starter Kit for R8C/35C (Discontinued product)

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Part Data Attributes for DPS256X32CV3-35C by Twilight Technology Inc

DPS256X32CV3-35C
Twilight Technology Inc
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
Part Package Code
PGA
Package Description
PGA,
Pin Count
66
Reach Compliance Code
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
35 ns
Alternate Memory Width
16
JESD-30 Code
S-CPGA-P66
Memory Density
8388608 bit
Memory IC Type
SRAM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
66
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
10.16 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Want to compare parts?
  1. DPS256X32CV3-35C
    Twilight Technology Inc
    SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
    VS

Alternate Parts for DPS256X32CV3-35C

This table gives cross-reference parts and alternative options found for DPS256X32CV3-35C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256X32CV3-35C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
DPS256X32CV3-35I SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32CV3-35I
DPS256X32CV3-35M SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32CV3-35M
DPS256X32CV3-35M SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS256X32CV3-35C vs DPS256X32CV3-35M
DPS256X32CV3-35C SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32CV3-35C
DPS256X32CV3-35I SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS256X32CV3-35C vs DPS256X32CV3-35I
Part Number Description Manufacturer Compare
DPS256X32V3-85M SRAM Module, 256KX32, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32V3-85M
WS256K32-20HI SRAM Module, 256KX32, 20ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp DPS256X32CV3-35C vs WS256K32-20HI
DPS256X32CV3-35I SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS256X32CV3-35C vs DPS256X32CV3-35I
DPS256C32BV3-45C SRAM Module, 256KX32, 45ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.460 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256C32BV3-45C
DPS256X32V3-25I SRAM Module, 256KX32, 25ns, CMOS, CPGA66, STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32V3-25I
WS256K32N-25HC SRAM Module, 256KX32, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp DPS256X32CV3-35C vs WS256K32N-25HC
DPS256X32BV3-45B SRAM Module, 256KX32, 45ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS256X32CV3-35C vs DPS256X32BV3-45B
DPS256C32BV3-35C SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.460 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256C32BV3-35C
DPS256X32BV3-35C SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS256X32CV3-35C vs DPS256X32BV3-35C
DPS256X32AV3-70M SRAM Module, 256KX32, 70ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS256X32CV3-35C vs DPS256X32AV3-70M

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