There are no models available for this part yet.
Overview of DPS256X32CV3-35C by Twilight Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 5 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
R0K521350S000BE | Renesas Electronics Corporation | Renesas Starter Kit for R8C/35C (Discontinued product) |
CAD Models for DPS256X32CV3-35C by Twilight Technology Inc
Part Data Attributes for DPS256X32CV3-35C by Twilight Technology Inc
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
TWILIGHT TECHNOLOGY INC
|
Part Package Code
|
PGA
|
Package Description
|
PGA,
|
Pin Count
|
66
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
35 ns
|
Alternate Memory Width
|
16
|
JESD-30 Code
|
S-CPGA-P66
|
Memory Density
|
8388608 bit
|
Memory IC Type
|
SRAM MODULE
|
Memory Width
|
32
|
Number of Functions
|
1
|
Number of Terminals
|
66
|
Number of Words
|
262144 words
|
Number of Words Code
|
256000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
256KX32
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
PGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
10.16 mm
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
PIN/PEG
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
PERPENDICULAR
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Alternate Parts for DPS256X32CV3-35C
This table gives cross-reference parts and alternative options found for DPS256X32CV3-35C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256X32CV3-35C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
DPS256X32CV3-35I | SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32CV3-35C vs DPS256X32CV3-35I |
DPS256X32CV3-35M | SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32CV3-35C vs DPS256X32CV3-35M |
DPS256X32CV3-35M | SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32CV3-35C vs DPS256X32CV3-35M |
DPS256X32CV3-35C | SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32CV3-35C vs DPS256X32CV3-35C |
DPS256X32CV3-35I | SRAM Module, 256KX32, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32CV3-35C vs DPS256X32CV3-35I |