Part Details for DPS256S8AP-35I by B&B Electronics Manufacturing Company
Overview of DPS256S8AP-35I by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS256S8AP-35I
DPS256S8AP-35I CAD Models
DPS256S8AP-35I Part Data Attributes
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DPS256S8AP-35I
B&B Electronics Manufacturing Company
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Datasheet
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DPS256S8AP-35I
B&B Electronics Manufacturing Company
SRAM Module, 256KX8, 35ns, CMOS, CDMA32, CERAMIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
| Part Package Code | MODULE | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDMA-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 8e-7 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.195 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for DPS256S8AP-35I
This table gives cross-reference parts and alternative options found for DPS256S8AP-35I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256S8AP-35I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS256S8BN-35C | SRAM Module, 256KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | B&B Electronics Manufacturing Company | DPS256S8AP-35I vs DPS256S8BN-35C |
| DPS256S8BN-35I | SRAM Module, 256KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | B&B Electronics Manufacturing Company | DPS256S8AP-35I vs DPS256S8BN-35I |
| DPS256S8BN-35B | SRAM Module, 256KX8, 35ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | B&B Electronics Manufacturing Company | DPS256S8AP-35I vs DPS256S8BN-35B |
| 5962-9315707HXA | SRAM Module, 256KX8, 35ns, CMOS, CDIP32, | Microsemi Corporation | DPS256S8AP-35I vs 5962-9315707HXA |
| 5962-9315707HXX | SRAM Module, 256KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | DPS256S8AP-35I vs 5962-9315707HXX |
| 5962-9315707HXC | SRAM Module, 256KX8, 35ns, CMOS, CDIP32, | Microsemi Corporation | DPS256S8AP-35I vs 5962-9315707HXC |
| DPS256S8AP-35C | SRAM Module, 256KX8, 35ns, CMOS, CDMA32, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPS256S8AP-35I vs DPS256S8AP-35C |