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Overview of DPS1MX8MKN3-30CA by B&B Electronics Manufacturing Company
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 9 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Education and Research
Environmental Monitoring
Industrial Automation
Audio and Video Systems
Agriculture Technology
Medical Imaging
Entertainment and Gaming
CAD Models for DPS1MX8MKN3-30CA by B&B Electronics Manufacturing Company
Part Data Attributes for DPS1MX8MKN3-30CA by B&B Electronics Manufacturing Company
|
|
|
|---|---|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
DPAC TECHNOLOGIES CORP
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|
Part Package Code
|
DIP
|
|
Package Description
|
ADIP,
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|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
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|
HTS Code
|
8542.32.00.41
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|
Access Time-Max
|
30 ns
|
|
JESD-30 Code
|
R-CDIP-T32
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|
Length
|
41.402 mm
|
|
Memory Density
|
8388608 bit
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Memory IC Type
|
STANDARD SRAM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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32
|
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Number of Words
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1048576 words
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|
Number of Words Code
|
1000000
|
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Operating Mode
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ASYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
1MX8
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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|
Package Code
|
ADIP
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Package Shape
|
RECTANGULAR
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Package Style
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IN-LINE, PIGGYBACK
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|
Parallel/Serial
|
PARALLEL
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|
Qualification Status
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Not Qualified
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Seated Height-Max
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7.2644 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
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|
Supply Voltage-Min (Vsup)
|
4.5 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
|
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Technology
|
CMOS
|
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Temperature Grade
|
COMMERCIAL
|
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Terminal Form
|
THROUGH-HOLE
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|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
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|
Width
|
15.24 mm
|
Alternate Parts for DPS1MX8MKN3-30CA
This table gives cross-reference parts and alternative options found for DPS1MX8MKN3-30CA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS1MX8MKN3-30CA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS1MX8MKN3-30C | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30C |
| DPS1MX8MKN3-30MA | Standard SRAM, 1MX8, 30ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30MA |
| DPS1MX8MKN3-30M | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30M |
| DPS1MX8MKN3-30I | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30I |
| DPS1MX8MKN3-30IA | Standard SRAM, 1MX8, 30ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30IA |
| DPS1MX8MKN3-30B | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30B |
| DPS1MX8MKN3-30I | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30I |
| DPS1MX8MKN3-30M | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30M |
| DPS1MX8MKN3-30C | SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-30CA vs DPS1MX8MKN3-30C |