Part Details for DPS1MX8MKN3-25M by Twilight Technology Inc
Overview of DPS1MX8MKN3-25M by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Environmental Monitoring
Industrial Automation
Audio and Video Systems
Agriculture Technology
Medical Imaging
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LPS6225-105MLC | Coilcraft Inc | General Purpose Inductor, 1000uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT | |
| LPS6225-154MLC | Coilcraft Inc | General Purpose Inductor, 150uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT | |
| LPS6225-224MLC | Coilcraft Inc | General Purpose Inductor, 220uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT |
Part Details for DPS1MX8MKN3-25M
DPS1MX8MKN3-25M CAD Models
DPS1MX8MKN3-25M Part Data Attributes
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DPS1MX8MKN3-25M
Twilight Technology Inc
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Datasheet
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DPS1MX8MKN3-25M
Twilight Technology Inc
SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
| Part Package Code | MODULE | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDMA-T32 | |
| Memory Density | 8388608 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 1MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B (Modified) | |
| Standby Current-Max | 0.0036 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.24 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for DPS1MX8MKN3-25M
This table gives cross-reference parts and alternative options found for DPS1MX8MKN3-25M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS1MX8MKN3-25M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS1MX8MKN3-25BA | Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25BA |
| DPS1MX8MKN3-25I | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25I |
| DPS1MX8MKN3-25B | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25B |
| DPS1MX8MKN3-25I | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25I |
| DPS1MX8MKN3-25M | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25M |
| DPS1MX8MKN3-25MA | Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25MA |
| DPS1MX8MKN3-25CA | Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25CA |
| DPS1MX8MKN3-25B | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25B |
| DPS1MX8MKN3-25C | SRAM Module, 1MX8, 25ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | B&B Electronics Manufacturing Company | DPS1MX8MKN3-25M vs DPS1MX8MKN3-25C |