Part Details for DPS128X32BV3-30I by Twilight Technology Inc
Overview of DPS128X32BV3-30I by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for DPS128X32BV3-30I
DPS128X32BV3-30I CAD Models
DPS128X32BV3-30I Part Data Attributes
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DPS128X32BV3-30I
Twilight Technology Inc
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Datasheet
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DPS128X32BV3-30I
Twilight Technology Inc
SRAM Module, 128KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA66,11X11 | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 30 ns | |
| Additional Feature | USER CONFIGURABLE AS 512K X 8 | |
| Alternate Memory Width | 16 | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CPGA-P66 | |
| Length | 30.226 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA66,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.4008 mm | |
| Standby Current-Max | 0.0016 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.56 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 30.226 mm |
Alternate Parts for DPS128X32BV3-30I
This table gives cross-reference parts and alternative options found for DPS128X32BV3-30I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS128X32BV3-30I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS128X32BV3-30C | SRAM Module, 128KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32BV3-30I vs DPS128X32BV3-30C |
| DPS128X32BV3-30M | SRAM Module, 128KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32BV3-30I vs DPS128X32BV3-30M |
| DPS128X32BV3-30I | SRAM Module, 128KX32, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS128X32BV3-30I vs DPS128X32BV3-30I |