Datasheets
DM54S570J by:

IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM

Part Details for DM54S570J by Texas Instruments

Overview of DM54S570J by Texas Instruments

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Part Details for DM54S570J

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DM54S570J Part Data Attributes

DM54S570J Texas Instruments
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DM54S570J Texas Instruments IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 65 ns
JESD-30 Code R-GDIP-T16
JESD-609 Code e0
Length 19.43 mm
Memory Density 2048 bit
Memory IC Type OTP ROM
Memory Width 4
Number of Functions 1
Number of Terminals 16
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512X4
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for DM54S570J

This table gives cross-reference parts and alternative options found for DM54S570J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM54S570J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DM54S571J IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM National Semiconductor Corporation DM54S570J vs DM54S571J
DM54S571J/883B 512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16 Texas Instruments DM54S570J vs DM54S571J/883B
DM54S571J/883B IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM National Semiconductor Corporation DM54S570J vs DM54S571J/883B
DM54S571J/883 512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16 Texas Instruments DM54S570J vs DM54S571J/883
Part Number Description Manufacturer Compare
63S240NXXXX OTP ROM, 512X4, 45ns, CMOS, PDIP16, Monolithic Memories (RETIRED) DM54S570J vs 63S240NXXXX
N82S130NB 512X4 OTPROM, 50ns, PDIP16 Philips Semiconductors DM54S570J vs N82S130NB
AM27S12ADCB OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD DM54S570J vs AM27S12ADCB
53S241AJ883B OTP ROM, 512X4, 45ns, CMOS, CDIP16, Monolithic Memories (RETIRED) DM54S570J vs 53S241AJ883B
AM27S12ADC OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD DM54S570J vs AM27S12ADC
HM1-7621-8 OTP ROM, 512X4, 85ns, TTL, CDIP16 Harris Semiconductor DM54S570J vs HM1-7621-8
M38510/20403BEX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v DM54S570J vs M38510/20403BEX
AM27S13DC OTP ROM, 512X4, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD DM54S570J vs AM27S13DC
53S241J883B OTP ROM, 512X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) DM54S570J vs 53S241J883B
M38510/20402BEA OTP ROM, 512X4, 85ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc DM54S570J vs M38510/20402BEA

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