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Overview of DM2213T-12 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for DM2213T-12 by Cypress Semiconductor
Part Data Attributes for DM2213T-12 by Cypress Semiconductor
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Rohs Code
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No
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Package Description
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TSOP, TSOP44,.36,32
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.02
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Access Time-Max
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12 ns
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I/O Type
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COMMON
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JESD-30 Code
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R-PDSO-G44
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Memory Density
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4194304 bit
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Memory IC Type
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EDO DRAM
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Memory Width
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8
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Number of Terminals
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44
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Number of Words
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524288 words
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Number of Words Code
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512000
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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512KX8
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TSOP
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Package Equivalence Code
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TSOP44,.36,32
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE, THIN PROFILE
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Qualification Status
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Not Qualified
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Refresh Cycles
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1024
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Standby Current-Max
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0.001 A
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Supply Current-Max
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0.225 mA
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Form
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GULL WING
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Terminal Pitch
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0.8 mm
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Terminal Position
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DUAL
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