Part Details for DE5517A-200 by LSI Corporation
Overview of DE5517A-200 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DE5517A-200
DE5517A-200 CAD Models
DE5517A-200 Part Data Attributes
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DE5517A-200
LSI Corporation
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Datasheet
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DE5517A-200
LSI Corporation
EEPROM, 2KX8, 200ns, Parallel, NMOS, CDIP28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
Package Description | DIP, DIP28,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 200 ns | |
Additional Feature | AUTOMATIC WRITE | |
Command User Interface | NO | |
Data Polling | YES | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Toggle Bit | NO | |
Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for DE5517A-200
This table gives cross-reference parts and alternative options found for DE5517A-200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DE5517A-200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
PQ2817AH-200 | EEPROM, 2KX8, 200ns, Parallel, NMOS, PDIP28 | LSI Corporation | DE5517A-200 vs PQ2817AH-200 |
AM2817A-2DEB | EEPROM, 2KX8, 200ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | DE5517A-200 vs AM2817A-2DEB |
CAT28C17API-20 | 2KX8 EEPROM 5V, 200ns, PDIP28, PLASTIC, DIP-28 | onsemi | DE5517A-200 vs CAT28C17API-20 |
AM2817A-20DCB | EEPROM, 2KX8, 200ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | DE5517A-200 vs AM2817A-20DCB |
CAT28C17ALI-20 | 2KX8 EEPROM 5V, 200ns, PDIP28, LEAD AND HALOGEN FREE, PLASTIC, DIP-28 | onsemi | DE5517A-200 vs CAT28C17ALI-20 |
28C17A-20I/P | 2K X 8 EEPROM 5V, 200 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Microchip Technology Inc | DE5517A-200 vs 28C17A-20I/P |
2817A-2 | EEPROM, 2KX8, 200ns, Parallel, MOS, PDIP28, DIP-28 | Intel Corporation | DE5517A-200 vs 2817A-2 |
AM2817A-2DC | EEPROM, 2KX8, 200ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | DE5517A-200 vs AM2817A-2DC |
CAT28C17AL-20T | 2KX8 EEPROM 5V, 200ns, PDIP28, 0.600 INCH, HALOGEN AND LEAD FREE, PLASTIC, MS-001, DIP-28 | onsemi | DE5517A-200 vs CAT28C17AL-20T |
AM2817A-20DE | EEPROM, 2KX8, 200ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | AMD | DE5517A-200 vs AM2817A-20DE |