Part Details for DE27128-25 by LSI Corporation
Overview of DE27128-25 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for DE27128-25
DE27128-25 CAD Models
DE27128-25 Part Data Attributes
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DE27128-25
LSI Corporation
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Datasheet
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DE27128-25
LSI Corporation
UVPROM, 16KX8, 250ns, NMOS, CDIP28,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
Package Description | DIP, DIP28,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
Additional Feature | 21V PROGRAMMING VOLTAGE | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 131072 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 16384 words | |
Number of Words Code | 16000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 21 V | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.12 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for DE27128-25
This table gives cross-reference parts and alternative options found for DE27128-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DE27128-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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NMC27C128BQ250 | IC 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | DE27128-25 vs NMC27C128BQ250 |
LH57128J-25 | UVPROM, 16KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Sharp Corp | DE27128-25 vs LH57128J-25 |
TMS27C128-25JL | 131 072-Bit UV Erasable Programmable Read-Only Memory 28-CDIP 0 to 70 | Texas Instruments | DE27128-25 vs TMS27C128-25JL |
AM27C128-255DEB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | DE27128-25 vs AM27C128-255DEB |
27C128-25/J | 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | DE27128-25 vs 27C128-25/J |
AM27C128-255DC | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | DE27128-25 vs AM27C128-255DC |
AM27C128-255DCB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | DE27128-25 vs AM27C128-255DCB |
5962-8766106XX | 16K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Microchip Technology Inc | DE27128-25 vs 5962-8766106XX |
AM27C128-250DEB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | DE27128-25 vs AM27C128-250DEB |
AM27C128-250DE | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | DE27128-25 vs AM27C128-250DE |