Part Details for D6417750RBA240HVU0 by Renesas Electronics Corporation
Overview of D6417750RBA240HVU0 by Renesas Electronics Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for D6417750RBA240HVU0
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
D6417750RBA240HVU0-ND
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DigiKey | IC MCU 32BIT ROMLESS 256BGA Min Qty: 1 Lead time: 36 Weeks Container: Tray |
17 In Stock |
|
$43.4330 / $46.5500 | Buy Now |
|
DISTI #
D6417750RBA240HVU0
|
Avnet Americas | MCU 32-Bit SuperH SH-4 RISC ROMLess 3.3V 256-Pin BGA - Trays (Alt: D6417750RBA240HVU0) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 36 Weeks, 0 Days Container: Tray | 0 |
|
$32.7025 / $37.3375 | Buy Now |
|
DISTI #
968-417750RBA240HVU0
|
Mouser Electronics | 32-bit Microcontrollers - MCU SH4 7750R BGA256-27x27 ES RoHS: Compliant | 324 |
|
$37.7000 / $46.5400 | Buy Now |
|
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 40 Package Multiple: 40 Container: Tray | 0Tray |
|
$32.1900 | Buy Now |
|
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Renesas Electronics America | IC MCU 32BIT ROMLESS 256BGA Min Qty: 1 Container: Tray | 17 |
|
$43.4330 / $46.5500 | Buy Now |
Part Details for D6417750RBA240HVU0
D6417750RBA240HVU0 CAD Models
D6417750RBA240HVU0 Part Data Attributes:
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D6417750RBA240HVU0
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
D6417750RBA240HVU0
Renesas Electronics Corporation
32-bit Microcontrollers, BGA, /
|
| Pbfree Code | Yes | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | PRBG0256DM | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 36 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 34 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Seated Height-Max | 2.6 mm | |
| Speed | 240 MHz | |
| Supply Voltage-Max | 1.6 V | |
| Supply Voltage-Min | 1.35 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |