Part Details for D3624-4 by Intel Corporation
Overview of D3624-4 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Electronic Manufacturing
Part Details for D3624-4
D3624-4 CAD Models
D3624-4 Part Data Attributes
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D3624-4
Intel Corporation
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Datasheet
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D3624-4
Intel Corporation
OTP ROM, 512X8, 90ns, TTL, CDIP24,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 90 ns | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 4096 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Terminals | 24 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512X8 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.19 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for D3624-4
This table gives cross-reference parts and alternative options found for D3624-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of D3624-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
53RA481AJS883B | OTP ROM, 512X8, 30ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | D3624-4 vs 53RA481AJS883B |
5962-88518053A | OTP ROM, 512X8, CMOS, CQCC28, CERAMIC, LCC-28 | Cypress Semiconductor | D3624-4 vs 5962-88518053A |
AM27S25LCB-S | OTP ROM, 512X8, 27ns, Bipolar, CQCC28, CERAMIC, LCC-28 | AMD | D3624-4 vs AM27S25LCB-S |
AM27S25APCB | OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | D3624-4 vs AM27S25APCB |
5962-8851803LB | OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | D3624-4 vs 5962-8851803LB |
82S141/BJA | IC 512 X 8 OTPROM, 90 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM | NXP Semiconductors | D3624-4 vs 82S141/BJA |
TBP28L46NW | 512X8 OTPROM, 95ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Texas Instruments | D3624-4 vs TBP28L46NW |
DM74S474J | IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | D3624-4 vs DM74S474J |
CY7C225A-25DI | OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | Cypress Semiconductor | D3624-4 vs CY7C225A-25DI |
6341-1JXXXX | OTP ROM, 512X8, 70ns, CMOS, CDIP24, | Monolithic Memories (RETIRED) | D3624-4 vs 6341-1JXXXX |