Part Details for CYV15G0101DXB-BBXC by Infineon Technologies AG
Overview of CYV15G0101DXB-BBXC by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for CYV15G0101DXB-BBXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CYV15G0101DXB-BBXC-ND
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DigiKey | IC TELECOM INTERFACE 100TBGA Lead time: 98 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Rochester Electronics | CYV15G0101DXB - Single-channel HOTLink II Transceiver ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 79 |
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$80.1300 / $94.2700 | Buy Now |
Part Details for CYV15G0101DXB-BBXC
CYV15G0101DXB-BBXC CAD Models
CYV15G0101DXB-BBXC Part Data Attributes
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CYV15G0101DXB-BBXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CYV15G0101DXB-BBXC
Infineon Technologies AG
Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-100 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Data Rate | 1500000 Mbps | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 11 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Transceivers | 1 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,10X10,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.5 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 11 mm |
Alternate Parts for CYV15G0101DXB-BBXC
This table gives cross-reference parts and alternative options found for CYV15G0101DXB-BBXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYV15G0101DXB-BBXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CYV15G0101DXB-BBXC | Interface Circuit, 1-Trnsvr, BICMOS, PBGA100, BGA-100 | Cypress Semiconductor | CYV15G0101DXB-BBXC vs CYV15G0101DXB-BBXC |