Part Details for CY8C5868LTI-LP039T by Cypress Semiconductor
Overview of CY8C5868LTI-LP039T by Cypress Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for CY8C5868LTI-LP039T
CY8C5868LTI-LP039T CAD Models
CY8C5868LTI-LP039T Part Data Attributes:
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CY8C5868LTI-LP039T
Cypress Semiconductor
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Datasheet
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CY8C5868LTI-LP039T
Cypress Semiconductor
Multifunction Peripheral, CMOS, QFN-68
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Package Description | HVQCCN, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Address Bus Width | ||
Boundary Scan | YES | |
Bus Compatibility | I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS | |
Clock Frequency-Max | 33 MHz | |
External Data Bus Width | ||
JESD-30 Code | S-XQCC-N68 | |
JESD-609 Code | e4 | |
Length | 8 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 38 | |
Number of Terminals | 68 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 32768 | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.4 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 8 mm |