Part Details for CY7C261-55DMB by Cypress Semiconductor
Overview of CY7C261-55DMB by Cypress Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
27C512-55DM/B | Rochester Electronics LLC | 27C512 - 512K (64K x 8) CMOS EPROM | |
AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
8655DMBT1B13KLF | Amphenol Communications Solutions | D-Sub Accessories, Input Output Connectors, 25 way Straight exit full metal hood with rubber grommet, short screws |
Price & Stock for CY7C261-55DMB
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | IC,EPROM,8KX8,CMOS,DIP,24PIN,CERAMIC | 1 |
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$204.0847 | Buy Now |
Part Details for CY7C261-55DMB
CY7C261-55DMB CAD Models
CY7C261-55DMB Part Data Attributes
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CY7C261-55DMB
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C261-55DMB
Cypress Semiconductor
OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | 0.300 INCH, SLIM, CERDIP-24 | |
Pin Count | 24 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 55 ns | |
Additional Feature | POWER SWITCHED PROM | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 31.877 mm | |
Memory Density | 65536 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.03 A | |
Supply Current-Max | 0.12 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for CY7C261-55DMB
This table gives cross-reference parts and alternative options found for CY7C261-55DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C261-55DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
27HC641-55I/P | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24 | CY7C261-55DMB vs 27HC641-55I/P |
CY7C264-55PI | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | CY7C261-55DMB vs CY7C264-55PI |
5962-9080301MLA | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | CY7C261-55DMB vs 5962-9080301MLA |
27HC641L-55/P | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, PLASTIC, DIP-24 | CY7C261-55DMB vs 27HC641L-55/P |
5962-9080305MLA | Cypress Semiconductor | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | CY7C261-55DMB vs 5962-9080305MLA |
93Z564ADMQB | Fairchild Semiconductor Corporation | Check for Price | OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 | CY7C261-55DMB vs 93Z564ADMQB |
5962-9080301MLA | Teledyne e2v | Check for Price | OTP ROM, 8KX8, 55ns, CMOS, CDIP24, | CY7C261-55DMB vs 5962-9080301MLA |
27HC641L-55I/SP | Microchip Technology Inc | Check for Price | 8K X 8 OTPROM, 55 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | CY7C261-55DMB vs 27HC641L-55I/SP |
8200902JA | AMD | Check for Price | OTP ROM, 8KX8, 55ns, Bipolar, CDIP24, 1.290 X 0.610 X 0.225 INCH, DIP-24 | CY7C261-55DMB vs 8200902JA |
N82HS641NB | NXP Semiconductors | Check for Price | IC 8K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM | CY7C261-55DMB vs N82HS641NB |