Part Details for CY7C2564XV18-366BZC by Infineon Technologies AG
Overview of CY7C2564XV18-366BZC by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C2564XV18-366BZC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C2564XV18-366BZC-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Bulk MARKETPLACE PRODUCT |
114 In Stock |
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$215.1000 | Buy Now |
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DISTI #
CY7C2564XV18-366BZC-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$191.7345 | Buy Now |
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DISTI #
CY7C2564XV18-366BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2564XV18-366BZ) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for CY7C2564XV18-366BZC
CY7C2564XV18-366BZC CAD Models
CY7C2564XV18-366BZC Part Data Attributes
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CY7C2564XV18-366BZC
Infineon Technologies AG
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Datasheet
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CY7C2564XV18-366BZC
Infineon Technologies AG
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 366 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 1.165 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 1.165 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm |