Part Details for CY7C1911JV18-300BZC by Rochester Electronics LLC
Overview of CY7C1911JV18-300BZC by Rochester Electronics LLC
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Part Details for CY7C1911JV18-300BZC
CY7C1911JV18-300BZC CAD Models
CY7C1911JV18-300BZC Part Data Attributes
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CY7C1911JV18-300BZC
Rochester Electronics LLC
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CY7C1911JV18-300BZC
Rochester Electronics LLC
2MX9 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FPBGA-165
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, FPBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX9 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |