Part Details for CY7C1425KV18-333BZXC by Infineon Technologies AG
Overview of CY7C1425KV18-333BZXC by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1425KV18-333BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
448-CY7C1425KV18-333BZXC-ND
|
DigiKey | IC SRAM 36MBIT PARALLEL 165FBGA Min Qty: 1360 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
|
$46.0281 | Buy Now |
DISTI #
727-CY7C1425KV18333B
|
Mouser Electronics | SRAM SYNC RoHS: Compliant | 0 |
|
$44.6900 | Order Now |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1360 Package Multiple: 1360 Lead time: 11 Weeks | 0 |
|
$44.6900 | Buy Now |
Part Details for CY7C1425KV18-333BZXC
CY7C1425KV18-333BZXC CAD Models
CY7C1425KV18-333BZXC Part Data Attributes
|
CY7C1425KV18-333BZXC
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1425KV18-333BZXC
Infineon Technologies AG
QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, FBGA-165
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 333 MHz | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4MX9 | |
Output Enable | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.28 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.73 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 13 mm |