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Overview of CY7C1424BV18-278BZXI by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
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CAD Models for CY7C1424BV18-278BZXI by Cypress Semiconductor
Part Data Attributes for CY7C1424BV18-278BZXI by Cypress Semiconductor
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|---|---|
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Pbfree Code
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Yes
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Part Package Code
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BGA
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Package Description
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LBGA, BGA165,11X15,40
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Pin Count
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165
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Access Time-Max
|
0.45 ns
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Additional Feature
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PIPELINED ARCHITECTURE
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I/O Type
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SEPARATE
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JESD-30 Code
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R-PBGA-B165
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JESD-609 Code
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e1
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Length
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17 mm
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Memory Density
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37748736 bit
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Memory IC Type
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DDR SRAM
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Memory Width
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36
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Terminals
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165
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Number of Words
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1048576 words
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Number of Words Code
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1000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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1MX36
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Equivalence Code
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BGA165,11X15,40
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
|
260
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.4 mm
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Standby Current-Max
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0.26 A
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Standby Voltage-Min
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1.7 V
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Supply Current-Max
|
0.775 mA
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Supply Voltage-Max (Vsup)
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1.9 V
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Supply Voltage-Min (Vsup)
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1.7 V
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Supply Voltage-Nom (Vsup)
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1.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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20
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Width
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15 mm
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