Datasheets
CY7C1371C-117BZI by: Cypress Semiconductor

ZBT SRAM, 512KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

Part Details for CY7C1371C-117BZI by Cypress Semiconductor

Overview of CY7C1371C-117BZI by Cypress Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for CY7C1371C-117BZI

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CY7C1371C-117BZI Part Data Attributes

CY7C1371C-117BZI Cypress Semiconductor
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CY7C1371C-117BZI Cypress Semiconductor ZBT SRAM, 512KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 7.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 117 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.07 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.19 mA
Supply Voltage-Max (Vsup) 3.63 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

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