There are no models available for this part yet.
Overview of CY7C1357C-133BGI by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
71V2546S133BGI8 | Renesas Electronics Corporation | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O | |
71V65603S133BGI8 | Renesas Electronics Corporation | 3.3V 256K X 36 ZBT Synchronous 3.3V I/O PipeLined SRAM | |
71V65803S133BGI8 | Renesas Electronics Corporation | 3.3V 512K x 18 ZBT Synchronous 3.3V I/O PipeLined SRAM |
CAD Models for CY7C1357C-133BGI by Cypress Semiconductor
Part Data Attributes for CY7C1357C-133BGI by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
14 X 22 MM, 2.40 MM HEIGHT, BGA-119
|
Pin Count
|
119
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
6.5 ns
|
Additional Feature
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B119
|
JESD-609 Code
|
e0
|
Length
|
22 mm
|
Memory Density
|
9437184 bit
|
Memory IC Type
|
ZBT SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
119
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512KX18
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA119,7X17,50
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.4 mm
|
Standby Current-Max
|
0.04 A
|
Standby Voltage-Min
|
3.14 V
|
Supply Current-Max
|
0.25 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Width
|
14 mm
|
Alternate Parts for CY7C1357C-133BGI
This table gives cross-reference parts and alternative options found for CY7C1357C-133BGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1357C-133BGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1357C-133BGXI | ZBT SRAM, 512KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 | Cypress Semiconductor | CY7C1357C-133BGI vs CY7C1357C-133BGXI |
CY7C1357C-133BGXC | ZBT SRAM, 512KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 | Cypress Semiconductor | CY7C1357C-133BGI vs CY7C1357C-133BGXC |