Part Details for CY7C1311BV18-300BZI by Cypress Semiconductor
Overview of CY7C1311BV18-300BZI by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for CY7C1311BV18-300BZI
CY7C1311BV18-300BZI CAD Models
CY7C1311BV18-300BZI Part Data Attributes
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CY7C1311BV18-300BZI
Cypress Semiconductor
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Datasheet
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CY7C1311BV18-300BZI
Cypress Semiconductor
QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.26 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.55 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for CY7C1311BV18-300BZI
This table gives cross-reference parts and alternative options found for CY7C1311BV18-300BZI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1311BV18-300BZI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1311BV18-300BZXI | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1311BV18-300BZI vs CY7C1311BV18-300BZXI |
UPD44165084AF5-E33-EQ2 | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165 | NEC Electronics Group | CY7C1311BV18-300BZI vs UPD44165084AF5-E33-EQ2 |
UPD44165084AF5-E33-EQ2-A | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | NEC Electronics Group | CY7C1311BV18-300BZI vs UPD44165084AF5-E33-EQ2-A |
UPD44165084AF5-E33-EQ2-A | 2MX8 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | Renesas Electronics Corporation | CY7C1311BV18-300BZI vs UPD44165084AF5-E33-EQ2-A |
CY7C1311BV18-300BZC | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1311BV18-300BZI vs CY7C1311BV18-300BZC |