Part Details for CY7C1297A-66AC by Rochester Electronics LLC
Overview of CY7C1297A-66AC by Rochester Electronics LLC
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Renewable Energy
Robotics and Drones
Available Datasheets
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Part Details for CY7C1297A-66AC
CY7C1297A-66AC CAD Models
CY7C1297A-66AC Part Data Attributes
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CY7C1297A-66AC
Rochester Electronics LLC
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Datasheet
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CY7C1297A-66AC
Rochester Electronics LLC
Standard SRAM, 64KX18, 9ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
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Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Package Description | LQFP, | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 9 ns | |
JESD-30 Code | R-PQFP-G100 | |
Length | 20 mm | |
Memory Density | 1179648 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3.1 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |