Part Details for CY7C1150KV18-400BZXI by Infineon Technologies AG
Overview of CY7C1150KV18-400BZXI by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for CY7C1150KV18-400BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
CY7C1150KV18-400BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray (Alt: CY7C1150KV18-400BZ) RoHS: Compliant Min Qty: 23 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 1859 Partner Stock |
|
$27.8132 / $33.6450 | Buy Now |
|
DISTI #
CY7C1150KV18-400BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1150KV18-400BZ) RoHS: Compliant Min Qty: 10 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 235 Partner Stock |
|
$30.3500 / $37.4900 | Buy Now |
Part Details for CY7C1150KV18-400BZXI
CY7C1150KV18-400BZXI CAD Models
CY7C1150KV18-400BZXI Part Data Attributes
|
|
CY7C1150KV18-400BZXI
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1150KV18-400BZXI
Infineon Technologies AG
DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, FBGA-165
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.29 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.64 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for CY7C1150KV18-400BZXI
This table gives cross-reference parts and alternative options found for CY7C1150KV18-400BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1150KV18-400BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8182D36BD-375MT | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1150KV18-400BZXI vs GS8182D36BD-375MT |
| GS8161E36DGD-333I | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1150KV18-400BZXI vs GS8161E36DGD-333I |
| IS61VF51236A-7.5TQVI | 512KX36 CACHE SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100 | Integrated Silicon Solution Inc | CY7C1150KV18-400BZXI vs IS61VF51236A-7.5TQVI |
| IDT71V2548XS133PFI | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 | Integrated Device Technology Inc | CY7C1150KV18-400BZXI vs IDT71V2548XS133PFI |
| GS832118AD-333IVT | Cache SRAM, 2MX18, 5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1150KV18-400BZXI vs GS832118AD-333IVT |
| GS8161E36DGD-150V | Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1150KV18-400BZXI vs GS8161E36DGD-150V |
| CY7C1163KV18-400BZI | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C1150KV18-400BZXI vs CY7C1163KV18-400BZI |
| CY7C1150KV18-400BZXI | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1150KV18-400BZXI vs CY7C1150KV18-400BZXI |
| GS832136AD-333IV | Cache SRAM, 1MX36, 5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1150KV18-400BZXI vs GS832136AD-333IV |
| R1Q3A3636ABG-40R | IC,SYNC SRAM,QDR,1MX36,CMOS,BGA,165PIN,PLASTIC | Renesas Electronics Corporation | CY7C1150KV18-400BZXI vs R1Q3A3636ABG-40R |