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Overview of CY7C1061AV33-10BAXI by Rochester Electronics LLC
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- Distributor Offerings: ( 0 listings )
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- Part Data Attributes ( Available )
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CAD Models for CY7C1061AV33-10BAXI by Rochester Electronics LLC
Part Data Attributes for CY7C1061AV33-10BAXI by Rochester Electronics LLC
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|
---|---|
Part Life Cycle Code
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Active
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Ihs Manufacturer
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ROCHESTER ELECTRONICS LLC
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Part Package Code
|
BGA
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Package Description
|
TFBGA,
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Pin Count
|
60
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Reach Compliance Code
|
unknown
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Access Time-Max
|
10 ns
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JESD-30 Code
|
R-PBGA-B60
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Length
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20 mm
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Memory Density
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16777216 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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16
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Number of Functions
|
1
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Number of Terminals
|
60
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Number of Words
|
1048576 words
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Number of Words Code
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1000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
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-40 °C
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Organization
|
1MX16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TFBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Parallel/Serial
|
PARALLEL
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Qualification Status
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COMMERCIAL
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Seated Height-Max
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1.2 mm
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Supply Voltage-Max (Vsup)
|
3.6 V
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Supply Voltage-Min (Vsup)
|
3 V
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Supply Voltage-Nom (Vsup)
|
3.3 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
INDUSTRIAL
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Terminal Form
|
BALL
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Terminal Pitch
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0.75 mm
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Terminal Position
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BOTTOM
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Width
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8 mm
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