Part Details for CY62147CV30LL-55BAI by Cypress Semiconductor
Overview of CY62147CV30LL-55BAI by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY62147CV30LL-55BAI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
2156-CY62147CV30LL-55BAI-ND
|
DigiKey | IC SRAM 4MBIT PARALLEL 48FBGA Min Qty: 120 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
1125 In Stock |
|
$2.5100 | Buy Now |
|
|
Rochester Electronics | SLOW 3.0V SUPER LOW POWER 256K X 16 SRAM ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 1125 |
|
$2.0500 / $2.4100 | Buy Now |
Part Details for CY62147CV30LL-55BAI
CY62147CV30LL-55BAI CAD Models
CY62147CV30LL-55BAI Part Data Attributes
|
|
CY62147CV30LL-55BAI
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CY62147CV30LL-55BAI
Cypress Semiconductor
Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, 7 X 8.50 MM, 1.20 MM HEIGHT, FINE PITCH, TBGA-48
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 7 X 8.50 MM, 1.20 MM HEIGHT, FINE PITCH, TBGA-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e0 | |
| Length | 8.5 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00001 A | |
| Standby Voltage-Min | 1.5 V | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 7 mm |