Part Details for CY2SSTU32866BFXCT by Cypress Semiconductor
Overview of CY2SSTU32866BFXCT by Cypress Semiconductor
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Part Details for CY2SSTU32866BFXCT
CY2SSTU32866BFXCT CAD Models
CY2SSTU32866BFXCT Part Data Attributes
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CY2SSTU32866BFXCT
Cypress Semiconductor
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CY2SSTU32866BFXCT
Cypress Semiconductor
D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, 13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | |
| Family | SSTU | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Number of Bits | 25 | |
| Number of Functions | 1 | |
| Number of Terminals | 96 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 1.87 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Trigger Type | POSITIVE EDGE | |
| Width | 5.5 mm | |
| fmax-Min | 500 MHz |