Part Details for CSPU877BV8 by Integrated Device Technology Inc
Overview of CSPU877BV8 by Integrated Device Technology Inc
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Part Details for CSPU877BV8
CSPU877BV8 CAD Models
CSPU877BV8 Part Data Attributes
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CSPU877BV8
Integrated Device Technology Inc
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Datasheet
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CSPU877BV8
Integrated Device Technology Inc
Clock Driver, CMOS, PBGA52
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Package Description | FBGA, BGA52,6X10,25 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PBGA-B52 | |
| JESD-609 Code | e0 | |
| Max I(ol) | 0.009 A | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 52 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA52,6X10,25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 |