There are no models available for this part yet.
Overview of CL10C2R7BB8ALNP by Samsung Electro-Mechanics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CL10C2R7BB8ALNP by Samsung Electro-Mechanics
Part Data Attributes for CL10C2R7BB8ALNP by Samsung Electro-Mechanics
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
SAMSUNG ELECTRO-MECHANICS
|
Package Description
|
, 0603
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
Capacitance
|
0.0000027 µF
|
Capacitor Type
|
CERAMIC CAPACITOR
|
Dielectric Material
|
CERAMIC
|
Height
|
0.8 mm
|
JESD-609 Code
|
e3
|
Length
|
1.6 mm
|
Mounting Feature
|
SURFACE MOUNT
|
Multilayer
|
Yes
|
Negative Tolerance
|
3.7037%
|
Number of Terminals
|
2
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Package Style
|
SMT
|
Packing Method
|
Bulk
|
Positive Tolerance
|
3.7037%
|
Rated (DC) Voltage (URdc)
|
50 V
|
Size Code
|
0603
|
Surface Mount
|
YES
|
Temperature Characteristics Code
|
C0G
|
Temperature Coefficient
|
30ppm/Cel ppm/°C
|
Terminal Finish
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Terminal Shape
|
WRAPAROUND
|
Width
|
0.8 mm
|
Alternate Parts for CL10C2R7BB8ALNP
This table gives cross-reference parts and alternative options found for CL10C2R7BB8ALNP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CL10C2R7BB8ALNP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
C0603T279B5GCC7081 | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7037% +Tol, 3.7037% -Tol, C0G, -/+30ppm/Cel TC, 0.0000027uF, 0603, | KEMET Corporation | CL10C2R7BB8ALNP vs C0603T279B5GCC7081 |
GCM1885C1H2R7BA16D | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | Murata Manufacturing Co Ltd | CL10C2R7BB8ALNP vs GCM1885C1H2R7BA16D |
C0603C0G500-2R7BN6R | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | VENKEL LTD | CL10C2R7BB8ALNP vs C0603C0G500-2R7BN6R |
CL10C2R7BB8ANND | Cap,Ceramic,2.7pF,50VDC,.1pF -Tol,.1pF +Tol,C0G TC Code,-30,30ppm TC,0603 Case | Samsung Semiconductor | CL10C2R7BB8ALNP vs CL10C2R7BB8ANND |
C0603T279B5GAC7081 | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7037% +Tol, 3.7037% -Tol, C0G, -/+30ppm/Cel TC, 0.0000027uF, 0603, | KEMET Corporation | CL10C2R7BB8ALNP vs C0603T279B5GAC7081 |
RF18N2R7B500CT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7% +Tol, 3.7% -Tol, C0G, 30ppm/Cel TC, 0.0000027uF, Surface Mount, 0603, CHIP | Walsin Technology Corporation | CL10C2R7BB8ALNP vs RF18N2R7B500CT |
CL10C2R7BB8ANNC | Cap,Ceramic,2.7pF,50VDC,.1pF -Tol,.1pF +Tol,C0G TC Code,-30,30ppm TC,0603 Case | Samsung Semiconductor | CL10C2R7BB8ALNP vs CL10C2R7BB8ANNC |
0603Y0502P70BCR | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7037% +Tol, 3.7037% -Tol, C0G, -/+30ppm/Cel TC, 0.0000027uF, 0603 | Syfer Technology | CL10C2R7BB8ALNP vs 0603Y0502P70BCR |
C0603COG500-2R7BG6B | Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.7037% +Tol, 3.7037% -Tol, C0G, -/+30ppm/Cel TC, 0.0000027uF, 0603, | VENKEL LTD | CL10C2R7BB8ALNP vs C0603COG500-2R7BG6B |
C0603X279B5GAL3190 | Ceramic Capacitor, Ceramic, | KEMET Corporation | CL10C2R7BB8ALNP vs C0603X279B5GAL3190 |