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Dual-channel square/sine-to-square wave clock buffer 8-DSBGA -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-42975-1-ND
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DigiKey | IC CLK BUFFER 1:2 52MHZ 8DSBGA Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
5400 In Stock |
|
$0.7336 / $1.5400 | Buy Now |
DISTI #
595-CDC3RL02BYFPR
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Mouser Electronics | Clock Buffer Dual-channel square/sine-to-square wave clock buffer 8-DSBGA -40 to 85 RoHS: Compliant | 3001 |
|
$0.7270 / $1.3100 | Buy Now |
DISTI #
V72:2272_10773232
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Arrow Electronics | Clock Fanout Buffer 2-OUT 1-IN 1:1 8-Pin DSBGA T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks Date Code: 2207 Container: Cut Strips | Americas - 363 |
|
$0.7001 / $0.9553 | Buy Now |
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Bristol Electronics | 2712 |
|
RFQ | ||
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Quest Components | 2169 |
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$0.8412 / $2.2432 | Buy Now | |
DISTI #
SMC-CDC3RL02BYFPR
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Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 2239 |
|
RFQ |
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CDC3RL02BYFPR
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
CDC3RL02BYFPR
Texas Instruments
Dual-channel square/sine-to-square wave clock buffer 8-DSBGA -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | DSBGA-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Family | CDC | |
Input Conditioning | STANDARD | |
JESD-30 Code | R-XBGA-B8 | |
JESD-609 Code | e1 | |
Length | 1.56 mm | |
Logic IC Type | LOW SKEW CLOCK DRIVER | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inverted Outputs | ||
Number of Terminals | 8 | |
Number of True Outputs | 2 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | VFBGA | |
Package Equivalence Code | BGA8,2X4,16 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 0.76 mm | |
fmax-Min | 52 MHz |