Datasheets
C57402AJ/883B by:

FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18

Part Details for C57402AJ/883B by AMD

Overview of C57402AJ/883B by AMD

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
ICL8212MTY/B Rochester Electronics LLC Replacement for Intersil part number ICL8212MTY/883B. Buy from authorized manufacturer Rochester Electronics.
79M06ML/B Rochester Electronics LLC Replacement for Texas Instruments part number UA79M06MLA/883B. Buy from authorized manufacturer Rochester Electronics.
IH5143MJE/883B Rochester Electronics LLC SPDT, 2 Func, 1 Channel, CMOS, CDIP16,

Part Details for C57402AJ/883B

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C57402AJ/883B Part Data Attributes

C57402AJ/883B AMD
Buy Now Datasheet
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C57402AJ/883B AMD FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 65 ns
Clock Frequency-Max (fCLK) 10 MHz
Cycle Time 100 ns
JESD-30 Code R-GDIP-T18
JESD-609 Code e0
Length 22.86 mm
Memory Density 320 bit
Memory IC Type OTHER FIFO
Memory Width 5
Number of Functions 1
Number of Terminals 18
Number of Words 64 words
Number of Words Code 64
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64X5
Output Characteristics TOTEM POLE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology TTL
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for C57402AJ/883B

This table gives cross-reference parts and alternative options found for C57402AJ/883B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of C57402AJ/883B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8779104VA FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 Monolithic Memories (RETIRED) C57402AJ/883B vs 5962-8779104VA
5962-8779108VA FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 Monolithic Memories (RETIRED) C57402AJ/883B vs 5962-8779108VA
5962-8779104VX FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 Monolithic Memories (RETIRED) C57402AJ/883B vs 5962-8779104VX
5962-8779108VX FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 AMD C57402AJ/883B vs 5962-8779108VX
5962-8779104VX FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 AMD C57402AJ/883B vs 5962-8779104VX
5962-8779108VX FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 Monolithic Memories (RETIRED) C57402AJ/883B vs 5962-8779108VX
57402AJ FIFO, 64X5, Asynchronous, TTL, CDIP18, Monolithic Memories (RETIRED) C57402AJ/883B vs 57402AJ
Part Number Description Manufacturer Compare
67C402-10N FIFO, 64X5, Asynchronous, CMOS, PDIP18, DIP-18 Monolithic Memories Inc (MMI) C57402AJ/883B vs 67C402-10N
C57402J/883B FIFO, 64X5, 70ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 AMD C57402AJ/883B vs C57402J/883B
L8C404CMB15 FIFO, 64X5, 55ns, Asynchronous, CMOS, CDIP18, 0.300 INCH, CERDIP-18 LOGIC Devices Inc C57402AJ/883B vs L8C404CMB15
L8C413PC45 FIFO, 64X5, 17ns, Asynchronous, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 LOGIC Devices Inc C57402AJ/883B vs L8C413PC45
5962-8779108VX FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 AMD C57402AJ/883B vs 5962-8779108VX
C67402N FIFO, 64X5, Asynchronous, TTL, PDIP18, Monolithic Memories (RETIRED) C57402AJ/883B vs C67402N
CY7C404-15PC FIFO, 64X5, 40ns, Asynchronous, CMOS, PDIP18, 0.300 INCH, DIP-18 Cypress Semiconductor C57402AJ/883B vs CY7C404-15PC
72404L10DB CDIP-18, Tube Integrated Device Technology Inc C57402AJ/883B vs 72404L10DB
CY7C404-25DMB FIFO, 64X5, 37ns, Asynchronous, CMOS, CDIP18, 0.300 INCH, CERDIP-18 Cypress Semiconductor C57402AJ/883B vs CY7C404-25DMB
C57402AJ FIFO, 64X5, Asynchronous, TTL, CDIP18, Monolithic Memories (RETIRED) C57402AJ/883B vs C57402AJ

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