There are no models available for this part yet.
Overview of C2109-4S6066 by Intel Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for C2109-4S6066 by Intel Corporation
Part Data Attributes for C2109-4S6066 by Intel Corporation
|
C2109-4S6066
Intel Corporation
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTEL CORP
|
|
Package Description
|
DIP, DIP16,.3
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.02
|
|
Access Time-Max
|
250 ns
|
|
I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-XDIP-T16
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
8192 bit
|
|
Memory IC Type
|
PAGE MODE DRAM
|
|
Memory Width
|
1
|
|
Number of Terminals
|
16
|
|
Number of Words
|
8192 words
|
|
Number of Words Code
|
8000
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
8KX1
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP16,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
64
|
|
Supply Current-Max
|
0.035 mA
|
|
Surface Mount
|
NO
|
|
Technology
|
MOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
Want to compare parts?
-
C2109-4S6066Intel CorporationPage Mode DRAM, 8KX1, 250ns, MOS, CDIP16VS
-