There are no models available for this part yet.
Overview of BU-61864G3-562K by Data Device Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
0805PS-562KB | Coilcraft Inc | General Purpose Inductor, 5.6uH, 10%, 1 Element, Ferrite-Core, SMD, 0805, CHIP, 0805, ROHS COMPLIANT | |
1812FS-562KLC | Coilcraft Inc | General Purpose Inductor, 5.6uH, 10%, 1 Element, Ceramic-ferrite-Core, SMD, 1812, CHIP, 1812, ROHS COMPLIANT | |
1008PS-562KLC | Coilcraft Inc | General Purpose Inductor, 5.6uH, 10%, 1 Element, Ceramic-ferrite-Core, SMD, 1515, CHIP, 1515, ROHS COMPLIANT |
CAD Models for BU-61864G3-562K by Data Device Corporation
Part Data Attributes for BU-61864G3-562K by Data Device Corporation
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
DATA DEVICE CORP
|
Part Package Code
|
QFP
|
Package Description
|
QFP,
|
Pin Count
|
72
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
16
|
Boundary Scan
|
NO
|
Clock Frequency-Max
|
20 MHz
|
Communication Protocol
|
MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760; MCAIR; STANAG-3838
|
Data Encoding/Decoding Method
|
BIPH-LEVEL(MANCHESTER)
|
Data Transfer Rate-Max
|
0.125 MBps
|
External Data Bus Width
|
16
|
JESD-30 Code
|
S-CQFP-G72
|
JESD-609 Code
|
e0
|
Length
|
25.4 mm
|
Low Power Mode
|
NO
|
Number of Serial I/Os
|
2
|
Number of Terminals
|
72
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
QFP
|
Package Equivalence Code
|
QFP72,1.38SQ,50
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK
|
Qualification Status
|
Not Qualified
|
Screening Level
|
MIL-STD-883
|
Seated Height-Max
|
3.94 mm
|
Supply Voltage-Max
|
3.6 V
|
Supply Voltage-Min
|
3 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
QUAD
|
Width
|
25.4 mm
|
uPs/uCs/Peripheral ICs Type
|
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
Alternate Parts for BU-61864G3-562K
This table gives cross-reference parts and alternative options found for BU-61864G3-562K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BU-61864G3-562K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
BU-61864G3-622Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-622Z |
BU-61864G3-772 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-772 |
BU-61864G3-782Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-782Z |
BU-61864G3-762Y | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-762Y |
BU-61864G3-372 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-372 |
BU-61864G3-782K | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-782K |
BU-61864G3-622Y | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-622Y |
BU-61864G3-672 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-672 |
BU-61864G3-682 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-682 |
BU-61864G3-722Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-562K vs BU-61864G3-722Z |