Part Details for BU-61864G3-450S by Data Device Corporation
Overview of BU-61864G3-450S by Data Device Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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2SA1645(0)-S-AZ | Renesas Electronics Corporation | Bipolar Power Transistors |
Part Details for BU-61864G3-450S
BU-61864G3-450S CAD Models
BU-61864G3-450S Part Data Attributes
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BU-61864G3-450S
Data Device Corporation
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Datasheet
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BU-61864G3-450S
Data Device Corporation
Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | DATA DEVICE CORP | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 72 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 16 | |
Boundary Scan | NO | |
Clock Frequency-Max | 20 MHz | |
Communication Protocol | ASYNC, BIT; SYNC, BYTE | |
Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
Data Transfer Rate-Max | 0.125 MBps | |
External Data Bus Width | 16 | |
JESD-30 Code | S-CQFP-G72 | |
JESD-609 Code | e0 | |
Length | 25.4 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | 2 | |
Number of Terminals | 72 | |
On Chip Data RAM Width | 17 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QFP | |
Package Equivalence Code | QFP72,1.0SQ,50 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
RAM (words) | 65536 | |
Screening Level | MIL-PRF-38534 Class H | |
Seated Height-Max | 3.3 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 25.4 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
Alternate Parts for BU-61864G3-450S
This table gives cross-reference parts and alternative options found for BU-61864G3-450S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BU-61864G3-450S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
BU-61864G3-130L | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-130L |
BU-61864G3-630Y | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-630Y |
5962-0151403HMX | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, QFP-72 | Data Device Corporation | BU-61864G3-450S vs 5962-0151403HMX |
BU-61864G3-450Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-450Z |
BU-61864G3-440L | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-440L |
BU-61864G3-650Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-650Z |
BU-61864G3-750K | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-750K |
BU-61864G3-740L | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-740L |
BU-61864G3-130S | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-130S |
BU-61864G3-630Q | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-61864G3-450S vs BU-61864G3-630Q |