Part Details for BS62LV4007TI55 by Brilliance Semiconductor Inc
Overview of BS62LV4007TI55 by Brilliance Semiconductor Inc
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Applications
Education and Research
Space Technology
Computing and Data Storage
Aerospace and Defense
Part Details for BS62LV4007TI55
BS62LV4007TI55 CAD Models
BS62LV4007TI55 Part Data Attributes
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BS62LV4007TI55
Brilliance Semiconductor Inc
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Datasheet
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BS62LV4007TI55
Brilliance Semiconductor Inc
Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, TSOP-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | BRILLIANCE SEMICONDUCTOR INC | |
Package Description | TSOP1, TSSOP32,.8,20 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDSO-G32 | |
JESD-609 Code | e0 | |
Length | 18.4 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSOP1 | |
Package Equivalence Code | TSSOP32,.8,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.0008 A | |
Standby Voltage-Min | 1.5 V | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Width | 8 mm |