There are no models available for this part yet.
Overview of BS616UV2019TC85 by Brilliance Semiconductor Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
CAD Models for BS616UV2019TC85 by Brilliance Semiconductor Inc
Part Data Attributes for BS616UV2019TC85 by Brilliance Semiconductor Inc
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
BRILLIANCE SEMICONDUCTOR INC
|
Package Description
|
TSSOP, TSSOP48,.71,20
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
85 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDSO-G48
|
JESD-609 Code
|
e0
|
Memory Density
|
2097152 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
16
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
48
|
Number of Words
|
131072 words
|
Number of Words Code
|
128000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
128KX16
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSSOP
|
Package Equivalence Code
|
TSSOP48,.71,20
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
240
|
Qualification Status
|
Not Qualified
|
Standby Current-Max
|
7e-7 A
|
Standby Voltage-Min
|
1 V
|
Supply Current-Max
|
0.011 mA
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|