Part Details for BS616LV1010ACP70 by Brilliance Semiconductor Inc
Overview of BS616LV1010ACP70 by Brilliance Semiconductor Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for BS616LV1010ACP70
BS616LV1010ACP70 CAD Models
BS616LV1010ACP70 Part Data Attributes
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BS616LV1010ACP70
Brilliance Semiconductor Inc
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Datasheet
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BS616LV1010ACP70
Brilliance Semiconductor Inc
Standard SRAM, 64KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, BGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | BRILLIANCE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA48,6X8,30 | |
Pin Count | 48 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B48 | |
Length | 8 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Voltage-Min | 1.5 V | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.4 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |