Part Details for BR24G02FVT-3AGTE2 by ROHM Semiconductor
Overview of BR24G02FVT-3AGTE2 by ROHM Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for BR24G02FVT-3AGTE2
BR24G02FVT-3AGTE2 CAD Models
BR24G02FVT-3AGTE2 Part Data Attributes:
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BR24G02FVT-3AGTE2
ROHM Semiconductor
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Datasheet
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BR24G02FVT-3AGTE2
ROHM Semiconductor
EEPROM
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Package Description | TSSOP, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 1 MHz | |
| JESD-30 Code | R-PDSO-G8 | |
| Length | 4.4 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | I2C | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | PURE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 3 mm | |
| Write Cycle Time-Max (tWC) | 5 ms |
Alternate Parts for BR24G02FVT-3AGTE2
This table gives cross-reference parts and alternative options found for BR24G02FVT-3AGTE2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR24G02FVT-3AGTE2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT24C02C-XHM-T | EEPROM, 256X8, Serial, CMOS, PDSO8, 4.40 MM, GREEN, PLASTIC, MO-153AA, TSSOP-8 | Atmel Corporation | BR24G02FVT-3AGTE2 vs AT24C02C-XHM-T |
| AT24C02C-XHM-T-537 | EEPROM, 256X8, Serial, CMOS, PDSO8 | Microchip Technology Inc | BR24G02FVT-3AGTE2 vs AT24C02C-XHM-T-537 |