Part Details for BK/C515-375MAS by Eaton Bussmann
Overview of BK/C515-375MAS by Eaton Bussmann
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
MC515FB2 | Rochester Electronics LLC | MC515 - J-K Flip-Flop, 1-Func, Negative Edge Triggered, TTL, CDFP14 | |
HM2P08PC5150Z1LF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, 5 Row Vertical Header, Type B, 125 Signal Pin, Press Fit Tail, 50 matingcycles and ROHS Compliant |
Part Details for BK/C515-375MAS
BK/C515-375MAS CAD Models
BK/C515-375MAS Part Data Attributes
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BK/C515-375MAS
Eaton Bussmann
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Datasheet
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BK/C515-375MAS
Eaton Bussmann
TIME DELAY BLOW ELECTRIC FUSE, 0.375A, 250VAC, 35A (IR), THROUGH HOLE
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | COOPER ELECTRONIC TECHNOLOGIES | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8536.10.00.40 | |
Blow Characteristic | TIME DELAY | |
Body Height | 15.2 mm | |
Body Length or Diameter | 5.5 mm | |
Circuit Protection Type | ELECTRIC FUSE | |
JESD-609 Code | e3 | |
Joule Integral-Nom | 1 J | |
Mounting Feature | THROUGH HOLE | |
Packing Method | BOX | |
Rated Breaking Capacity | 35 A | |
Rated Current | 0.375 A | |
Rated Voltage(AC) | 250 V | |
Reference Standard | CSA; UL | |
Surface Mount | NO | |
Terminal Finish | TIN | |
Terminal Shape | PIN WIRE |