Part Details for BH76909GU by ROHM Semiconductor
Overview of BH76909GU by ROHM Semiconductor
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Transportation and Logistics
Agriculture Technology
Telecommunications
Automotive
Education and Research
Computing and Data Storage
Aerospace and Defense
Healthcare
Electronic Manufacturing
Renewable Energy
Robotics and Drones
Part Details for BH76909GU
BH76909GU CAD Models
BH76909GU Part Data Attributes
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BH76909GU
ROHM Semiconductor
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Datasheet
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BH76909GU
ROHM Semiconductor
Consumer Circuit, PBGA8, 1.60 X 1.60 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, WLCSP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ROHM CO LTD | |
| Part Package Code | BGA | |
| Package Description | VFBGA, BGA8,3X3,20 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | S-PBGA-B8 | |
| JESD-609 Code | e1 | |
| Length | 1.68 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA8,3X3,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 25 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 1.68 mm |