Part Details for BGM1043N7E6327XUSA1 by Infineon Technologies AG
Overview of BGM1043N7E6327XUSA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for BGM1043N7E6327XUSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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NexGen Digital | 67401 |
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RFQ |
Part Details for BGM1043N7E6327XUSA1
BGM1043N7E6327XUSA1 CAD Models
BGM1043N7E6327XUSA1 Part Data Attributes
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BGM1043N7E6327XUSA1
Infineon Technologies AG
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Datasheet
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BGM1043N7E6327XUSA1
Infineon Technologies AG
Telecom Circuit, 1-Func, PDSO6, 2.30 X 1.70 MM, 0.73 MM HEIGHT, ROHS COMPLIANT, TSNP-7/6
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PDSO-N6 | |
| Length | 2.3 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.77 mm | |
| Supply Voltage-Nom | 2.7 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 1.7 mm |