|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
DFN
|
|
Package Description
|
1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN
|
|
Pin Count
|
2
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8541.10.00
|
|
Samacsys Manufacturer
|
NXP
|
|
Application
|
ATTENUATOR; SWITCHING
|
|
Breakdown Voltage-Min
|
30 V
|
|
Configuration
|
SINGLE
|
|
Diode Capacitance-Max
|
0.85 pF
|
|
Diode Capacitance-Nom
|
0.37 pF
|
|
Diode Element Material
|
SILICON
|
|
Diode Forward Resistance-Max
|
0.9 Ω
|
|
Diode Res Test Current
|
5 mA
|
|
Diode Res Test Frequency
|
100 MHz
|
|
Diode Type
|
PIN DIODE
|
|
JESD-30 Code
|
R-PDSO-N2
|
|
JESD-609 Code
|
e3
|
|
Minority Carrier Lifetime-Nom
|
0.18 µs
|
|
Moisture Sensitivity Level
|
1
|
|
Number of Elements
|
1
|
|
Number of Terminals
|
2
|
|
Operating Temperature-Max
|
150 °C
|
|
Operating Temperature-Min
|
-65 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Power Dissipation-Max
|
0.135 W
|
|
Qualification Status
|
Not Qualified
|
|
Reverse Test Voltage
|
20 V
|
|
Surface Mount
|
YES
|
|
Technology
|
POSITIVE-INTRINSIC-NEGATIVE
|
|
Terminal Finish
|
Tin (Sn)
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BAP65LX,315 | BAP65LX - Silicon PIN diode DFN 2-Pin | NXP Semiconductors | BAP65LX vs BAP65LX,315 |