Part Details for BAP64-03/DG/B2/AX by NXP Semiconductors
Overview of BAP64-03/DG/B2/AX by NXP Semiconductors
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Part Details for BAP64-03/DG/B2/AX
BAP64-03/DG/B2/AX CAD Models
BAP64-03/DG/B2/AX Part Data Attributes:
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BAP64-03/DG/B2/AX
NXP Semiconductors
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BAP64-03/DG/B2/AX
NXP Semiconductors
BAP64-03 - Silicon PIN diode SOD 2-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOD | |
| Package Description | PLASTIC, SC-76, 2 PIN | |
| Pin Count | 2 | |
| Manufacturer Package Code | SOD323 | |
| Reach Compliance Code | unknown | |
| Additional Feature | HIGH VOLTAGE | |
| Application | ATTENUATOR; SWITCHING | |
| Breakdown Voltage-Min | 175 V | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.35 pF | |
| Diode Capacitance-Nom | 0.48 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 1.35 Ω | |
| Diode Res Test Current | 0.5 mA | |
| Diode Res Test Frequency | 100 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | S BAND | |
| JESD-30 Code | R-PDSO-G2 | |
| Minority Carrier Lifetime-Nom | 1.55 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Power Dissipation-Max | 0.5 W | |
| Reference Standard | IEC-60134 | |
| Reverse Test Voltage | ||
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL |